HiSilicon海思半导体是全球领先的无晶圆厂半导体和IC设计公司，致力于提供全面的连接和多媒体芯片组解决方案。作为行业的领导者，HiSilicon海思半导体为全球连接和端到端超高清视频技术的创新铺平了道路。

从高速通信，智能设备，物联网到视频应用，HiSilicon芯片组和解决方案已在全球100多个国家和地区得到验证和认证：

对于无线通信而言，技术领先是一项巨大的成就，主要归功于公司对创新的追求。这包括成功推出Balong调制解调器，包括LTE Cat.4，Cat.6，Cat.12 / 13，Cat.18，Cat.19，Cat.21，双SIM和双LTE（带VoLTE）和伪基其他提供商领先的防御技术。HiSilicon海思半导体是第一个将5G无线芯片组商业化以推动5G产业发展的公司。

对于智能设备，HiSilicon的麒麟SoC提供高性能，高功效和超智能的移动AI解决方案，以创造卓越的用户体验。

对于AI应用，HiSilicon海思半导体提供全场景AI芯片组Ascend系列SoC，将AI从数据中心扩展到边缘和设备，为数据中心，边缘，消费设备和物联网场景提供AI计算能力，同时提供全新的解决方案安全城市，自动驾驶，云服务，IT智能，智能制造和机器人等创新用例，可加速各领域AI的实施。

对于视频应用，HiSilicon海思半导体推出了世界领先的智能IP摄像机，智能机顶盒和智能电视芯片，提供端到端的全8K / 4K产品和解决方案，专注于图像记录，解码和显示。

对于物联网应用，HiSilicon海思半导体推出了PLC / G.hn / Connectivity / NB-IoT产品，以构建可靠，安全的通道网络，用于连接各个家庭和各种行业的数字设备。

HiSilicon海思半导体总部位于中国深圳，在北京，上海，成都，武汉，新加坡，韩国，日本，欧洲和世界其他地区的办事处和研究中心拥有7,000多名员工。经过20多年的研发，HiSilicon海思已经建立了强大的IC设计和验证技术组合，开发了先进的EDA设计平台，并负责建立多个开发流程和法规。多年来，海思硅已成功开发了200多种拥有自主知识产权的模型，并申请了8000多项专利。HiSilicon海思还与生态系统领域的全球领导者建立了战略合作伙伴关系，特别是在可靠的供应链中进行工程（晶圆制造），封装和测试。

HiSilicon海思半导体的使命是提供最优质的解决方案和服务，并迅速响应客户 - 海思硅以客户为中心，致力于为客户创造价值。

HiSilicon is a global leading fabless semiconductor and IC design company that is dedicated to providing comprehensive connectivity and multimedia chipset solutions. As a prominent industry leader, HiSilicon paves the way for innovations in global connectivity and end-to-end ultra-HD video technologies.
From high-speed communications, smart devices, and IoT to video applications, HiSilicon chipsets and solutions have been proven and certified in more than 100 countries and regions in the world:

For wireless communications, technology leadership is a tremendous achievement and it is mainly contributed by the company’s pursuit of innovations. This includes the successful launch of Balong modems with LTE Cat.4, Cat.6, Cat.12/13, Cat.18, Cat.19, Cat.21, dual SIM & dual LTE (with VoLTE), and pseudo-base-station defense technologies ahead of other providers. HiSilicon is the first to commercialize 5G wireless chipsets to promote the 5G industry development.

For smart devices, HiSilicon’s Kirin SoCs provide high-performance, high-power-efficiency, and ultra-intelligent mobile AI solutions to create a superior user experience.

For AI applications, HiSilicon provides all-scenario AI chipset Ascend series SoC to extend AI from the data center to the edge and device, offering AI computing power towards data center, edge, consumer device and IoT scenarios, also provides brand-new solutions for the innovative use cases such as safety city, self-driving, cloud service, IT intelligence, smart manufacturing, and robots to accelerate the implementation of AI in each domain.

For video applications, HiSilicon has launched the world’s leading chips for smart IP cameras, smart STBs, and smart TVs, providing end-to-end full 8K/4K products and solutions that focus on image recording, decoding, and display.

For IoT applications, HiSilicon has launched PLC/G.hn/Connectivity/NB-IoT products to build a network of reliable and secure channels that serve to connect digital devices in each home and in a variety of industry.

Headquartered in Shenzhen, China, HiSilicon has over 7,000 employees in offices and research centers in Beijing, Shanghai, Chengdu, Wuhan, Singapore, South Korea, Japan, Europe and other regions across the world. After 20 years of research and development, HiSilicon has built up a strong portfolio of IC design and verification technologies, developed an advanced EDA design platform, and is responsible for the set up of several development processes and regulations. Over the years, HiSilicon has successfully developed more than 200 Models with proprietary IPR and filed over 8,000 patents. HiSilicon has also established strategic partnerships with global leaders in the ecosystem, specifically for engineering (wafer manufacturing), packaging, and testing within a reliable supply chain.

The mission of HiSilicon is to provide the best-quality solutions and services with a prompt response to the customers – HiSilicon is customer-centric and is committed to value creation for the customers.